-
Single Wet Processor
300mm Single Wafer Wet process equipment is designed to handle individual wafer substrate for high precison cleaning and stripping With optimized chemical supply and precise spin control enable low chemical consumption, superior process uniformity to achieve high yield and stable wet process performance.
Features
- Flexible configuration (1, 2, 4, 8, 12 chambers)
- Minimized cleaning chamber size
- Uniform flow control
- Reduced chemical consumption
Application
- Cleaning in FEOL or BEOL
- Pre Cleaning
- Post Etch Cleaning
- PR strip
- Post Dicing Cleaning
- CG Cleaning
- Etc.
-
Post Dicing Cleaner
200/300mm compatible ring-frame wafer cleaning system desigend to clean various particles generated after dicing OLEDoS wafer. It delivers over 98% particle removal efficiency and enables fully automated 200 and 300mm ring-frame wafer conversion
Features
- Flexible configuration (1, 2, 4, 8, 12 chambers)
- Minimized cleaning chamber size
- Uniform flow control
- Reduced chemical consumption
Application
- Cleaning in FEOL or BEOL
- Pre Cleaning
- Post Etch Cleaning
- PR strip
- Post Dicing Cleaning
- CG Cleaning
- Etc.