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Creating new value
with innovative technology.

  • Pre-deposition cleaner

    Positioned beside CVD or PVD chambers, the system reduces cross-contamination with enhanced space efficiency and driving significant yield imrovement through high performance cleaning technolongy

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Pre-photo cleaner

    The device utilizes high-performance technology to perfectly remove organic matter and moisture, achieving uniform PR coating and eliminating coating issues.

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • HF Cleaner

    In the LTPS process, this system removes contaminated oxide layer including organic contaminants and regenerates highly clean and uniform oxide layer before low temperature poly-crystallization and gate insulation deposition.

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Initial Cleaner

    As the equipment required for the first process of Panel manufacturing, it efficiently cleans the first contaminated substrate using powerful upgrade technology.

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Wet Stripper

    Equipment for stripping remaining PR (Photo Resist) after Etching pattern, delivers powerful production efficiency with enhanced chemical recycle performance and reduced power consumption.

    Features

    • Small Footprint (Compact Size)
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK,DMS-JET)
    • Low power consumption with HPS(Heat pump system) technology
    • Low chemical consumption through super efficient chemical recovery system

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Wet Etcher

    This system uniformily etches metal films during pattering process, delivers improved production efficiency through superior etching uniformity and enhanced chemical recycle performance

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Developer

    This equipment develops exposed photoresist (PR) during pattern formation, ensuring process stability through uniform chemical dispense and leveling control during transfer.

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • PI Coater

    Advanced coater designed to achieve outstanding coating uniformity for PI(Polyimid), which is used as the TFT base in flexible OLED display

    Features

    • Outstanding Productivity
      • Excellent coating performance and temperature uniformity, Quick Tack Time
      • High-precision degassing & Filtering System
    • Particle Reduction Configuration
      • Coater : Pump, Cleaning unit, Pipe, etc.
      • HVCD : Heater, Chamber Design, Exhaust, etc.
    • Optimized Design By Condition Of Customer
      • Nozzle Chamber Design, etc.

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process