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Single Wet Processor
300mm 晶圆单片式湿法工艺设备，以晶圆为单独单位进行处理，并执行高精度清洗、剥离等工艺。 通过优化的化学品供给和精密的旋转控制，以较低的药液使用量和出色的工艺均匀性，实现高合格率和稳定的湿法工艺性能。
Features
- Flexible configuration (1, 2, 4, 8, 12 chambers)
- Minimized cleaning chamber size
- Uniform flow control
- Reduced chemical consumption
Application
- Cleaning in FEOL or BEOL
- Pre Cleaning
- Post Etch Cleaning
- PR strip
- Post Dicing Cleaning
- CG Cleaning
- Etc.
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Post Dicing Cleaner
200/300mm 兼容的环形框架（Ring-frame）晶圆清洗机，具备清洗/干燥功能，可去除 OLEDoS 晶圆切割（Dicing）后产生的各种颗粒，颗粒去除率达 98%以上。 实现 98%以上的去除率，并可通过 100% 全自动方式实现 200mm 与 300mm Ring-Frame 晶圆的兼容混用。
Features
- Flexible configuration (1, 2, 4, 8, 12 chambers)
- Minimized cleaning chamber size
- Uniform flow control
- Reduced chemical consumption
Application
- Cleaning in FEOL or BEOL
- Pre Cleaning
- Post Etch Cleaning
- PR strip
- Post Dicing Cleaning
- CG Cleaning
- Etc.