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以创新技术创造新的价值

  • Pre-deposition cleaner

    与 CVD、PVD 一起，采用蒸镀工艺前的高性能清洗技术，有效利用空间并提高收益率

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Pre-photo cleaner

    该设备利用高性能技术完美去除有机物与水分，实现PR均匀涂布并消除Coating不良

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • HF Cleaner

    该设备采用的洗净技术，可以在LTPS制造工程中，清除蒸镀工程与结晶化工程前产生的有机异物和金属氧化膜

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Initial Cleaner

    作为Panel制造首道工序所需的设备，采用强效升级技术对最先投入的污染基板进行高效清洗

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Wet Stripper

    该设备用于剥离Pattern蚀刻（Etching）后残留的PR（Photo Resist），可强化Chemical回收能力，节约耗电量，提高生产效率

    Features

    • Small Footprint (Compact Size)
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK,DMS-JET)
    • 通过HPS节省电力能源
    • 通过有效的Chemical回收装置减少消耗量

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Wet Etcher

    该设备在Pattern形成过程中可均匀蚀刻（Etching）金属薄膜，通过保障稳定的Uniformity，强化Chemical回收能力，提高生产效率

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • Developer

    该设备在Pattern形成过程中对经曝光(Exposure)处理的PR(Photo Resist)进行显影，并通过均匀的Chemical Dispense和搬送平坦化实现Process稳定化

    Features

    • Small Footprint (Compact Size)
    • Yield Enhancement
    • Simple Design
    • Being Usable for 11th Generation
    • High Performance Modules (DB, RB, MJ, SM-JET, WMSC, OSC SWR, AK, DMS-JET)

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process

  • PI Coater

    该设备在Flexible OLED制造过程中，将可用作TFT基板的PI(Polyimide)均匀涂布在硬玻璃上

    Features

    • Outstanding Productivity
      • Excellent coating performance and temperature uniformity, Quick Tack Time
      • High-precision degassing & Filtering System
    • Particle Reduction Configuration
      • Coater : Pump, Cleaning unit, Pipe, etc.
      • HVCD : Heater, Chamber Design, Exhaust, etc.
    • Optimized Design By Condition Of Customer
      • Nozzle Chamber Design, etc.

    Application

    • a-Si TFT Process
    • Oxide TFT Process
    • LTPS Process
    • OLED Process
    • CF Process
    • CELL Process